二 電容 (Capacitor):

    SMT 電容之外型尺寸與電阻相同, 常用之外型尺寸有以下數(shù)種規(guī)格:

    SMT capacitor dimension is same as resistor, the dimension of common using is as below:

    SMT 電容在外觀上無(wú)法辨別其電容值, 需以電容表量測(cè)。

    Capacity value can’t show on the capacitor surface, it should be measured by meter.

    三 IC:

    (1) 名詞解釋(Definition):

    Pin: IC 腳 (又稱lead),。

    Pin: IC lead.

    Pitch: Pin的中心點(diǎn)到相鄰Pin的中心點(diǎn)之距離,。

    Pitch: Distance between pin center to next pin center.

    (2) 外觀分類(IC package type):

    2.1 SOP(Small Outline Package): IC腳位于本體兩側(cè), 呈L型向外延伸,。

     SOP(Small Outline Package): IC leads are L-shape and locate in 2 side of body.

    2.2 TSOP(Thin Small Outline Package): IC腳與SOP相同, 但本體厚度較SOP薄。

    TSOP(Thin Small Outline Package): The shape is similar to SOP, but it’s thinner than SOP.

    2.3 SOJ(Small Outline J-leaded Package): IC腳位于本體兩側(cè), 呈J型向內(nèi)彎曲,。

    SOJ(Small Outline J-leaded Package): IC leads are J-shape and locate in 2 sides of body.

    2.4 BGA(Ball Grid Array): IC腳呈球狀, 位于電路板(PCB)正下方,。

    BGA(Ball Grid Array): IC leads are solder ball and in the bottom side of substrate PCB. No substrate PCB in

    2.5 μBGA(Micro Ball Grid Array): IC腳呈球狀, 位于芯片(Chip)正下方, 無(wú)電路板(PCB)。

    μBGA(Micro Ball Grid Array): IC leads are solder ball and in the bottom side of chip, no PCB in μBGA.

    2.6 QFP(Quad Flat Package): IC腳位于本體四邊, 呈L型向外延伸,。

    QFP(Quad Flat Package): IC leads are L-shape and locate in 4 sides of b12/1/2008ody.

    2.7 PLCC(Plastic Leaded Chip Carrier): IC腳位于本體四邊, 呈J型向內(nèi)彎曲,。

    PLCC(Plastic Leaded Chip Carrier): IC leads are L-shape and locate in 4 sides of body.